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In this work, the TiO2-SrTiO3 hybrids were synthesized by a facile hydrothermal reaction using TiO2 as the titanium precursor under basic condition. By using the synthesized TiO2-SrTiO3 hybrids as fillers, the films of the TiO2-SrTiO3/PVDF composites were prepared. The dielectric property and insulation behavior of the films were investigated. High permittivity and improved breakdown strength of the...
In this study, 2-[2-(2-methoxyethoxy)ethoxy]acetic acid (MEEAA) was used to modify the surface of barium titanate nanoparticles (BT NPs) to enhance the compatibility and dispersion of the BT ceramic fillers in polymer matrix. A uniform coating layer with a thickness about 2 nm was formed on the surface of BT after modification. The poly(vinylidene fluoride)-hexafluoropropene [P(VDF-HFP)] composites...
Ceramic-polymer nanocomposites with high dielectric constant and energy density are becoming increasingly attractive in modern electronic and electric industry. However, the breakdown strength of composites was usually largely reduced due to the unstable interfacial interaction between ceramic filler and polymer matrix. In this study, the flexible nanocomposites comprising dopamine encapsulated BaTiO...
In this study, we report the large-scale fabrication of Cu@SiO2 nanoparticles with core-shell structure using a modified Stöber method. The obtained nanoparticles had an average particle size of 300 nm with SiO2 shell about 20 nm and exhibited excellent oxidation resistance and thermal stability in air atmosphere. PVDF based nanocomposites filled with pure Cu and Cu@SiO2 nanoparticles have been prepared...
In this study, we report the large-scale fabrication of Cu@SiO2 nanoparticles with core-shell structure using a modified Stöber method. The obtained nanoparticles had an average particle size of 300 nm with SiO2 shell about 20 nm and exhibited excellent oxidation resistance and thermal stability in air atmosphere. PVDF based nanocomposites filled with pure Cu and Cu@SiO2 nanoparticles have been prepared...
The miniaturization trend of integrated circuits (ICs) calls for replacing discrete passive components with embedded passives. Among the passive components, the embedded decoupling capacitors which are used for simultaneous switching noise suppression have drawn great attention. It is because decoupling capacitors should be placed as near as possible to a chip to reduce parasitic inductance. Important...
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