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Copper and its oxides nanoparticles have been widely studied because of their reasonable electrical and optical properties. Here, copper nanopatticles (Cu) were synthesized and oxidized at various temperature for one hour. The obtained copper oxides (CuxO, x=1 or 2) were well characterized by DSC/TGA, XRD and SEM techniques. The dielectric properties of the epoxy composites filled with Cu and CuxO...
Dielectric materials with high-K, low loss and high breakdown voltage are of great importance for a broad range of applications in modern electronics and electrical power systems. In this work, embedded capacitors were fabricated with BT/ER composites as the dielectric layer. The composites were modified with Cr Acac which reacted with epoxy matrix. The addition of PEG and Cr Acac enhanced the permittivity...
Dielectric materials with high-K, low loss and high breakdown voltage are of great importance for a broad range of applications in modern electronics and electrical power systems. In this work, embedded capacitors were fabricated with BT/ER composites as the dielectric layer. The composites were modified with Cr Acac which reacted with epoxy matrix. The addition of PEG and Cr Acac enhanced the permittivity...
This paper presents three related planar EBG (electromagnetic bandgap) structures based on embedded capacitors and inductors, which have small-footprints and can be used in package power or ground planes to provide wideband isolation among different parts of the power distribution network (PDN). Measurement shows −40dB isolation from 2–2.5GHz to over 10GHz. In order to improve performance at lower...
With the increasing needs for higher functionality and higher performance of electronic devices, the packaging technology is developing toward functionalization of the inner space of printed-wiring-boards (PWBs) by embedding active or passive components. As a passive component, embedded capacitors have been actively investigated, because they occupy about 40% amount of surface area on a substrate...
The design and analysis of the embedded capacitor and inductor based on organic substrate are discussed in this paper. Two structures of capacitor are designed in order to get the desirable capacitance value. The Vertically-Interdigitated-Capacitor (VIC) has higher capacitance value than Mental-Insulator-Mental (MIM) structure. For the embedded inductor, the factors affecting Q include skin effect,...
This paper reports a FeAISi (sendust)/CaCu3Ti4O12 (CCTO)/Epoxy three-phase composite prepared through a simple procedure. The magnetic-dielectric properties of the composites were analyzed using impedance analyzer (Agilent 4991) in a frequency range from 106 to 109 Hz. The results show the weak coupling effect between the FeAISi and CCTO fillers in the three-phase composite. The real permeability...
BaTiO3/Ba0.6Sr0.4TiO3/SrTiO3 (BT/B ST/ST, as one periodic structure) multilayer thin films were deposited on Pt/Ti/SiO2/Si substrates by a sol-gel method. Platinum electrodes were then patterned on the films by sputtering and lithographic process to form metal-ferroelectric-metal (MFM) capacitors. The multilayer thin films were crack free, compact and crystallized in perovskite structure. The crystallization...
Nano-sized Ag particles were prepared through a wet chemical reduction route and treated with tetraethoxysilane (TEOS) to form an amorphous SiO2 thin layer on the particles surface (Ag@SiO2). Ag@SiO2/Epoxy composite film was fabricated via coating process. The experimental results showed that the dielectric constant k increased gradually with Ag@SiO2 content before reaching the percolation threshold...
System on package (SOP) is an emerging technology, and provides an implementation options for system with small size, especially for mixed-signal systems. However, in such a compact package, noise generated by the digital chip can be easily coupled to the RF IC, and degrade the sensitivity of RF signal. In this paper, a simple and efficient multi-order lowpass filter for EMI and SSN suppression in...
The miniaturization trend of integrated circuits (ICs) calls for replacing discrete passive components with embedded passives. Among the passive components, the embedded decoupling capacitors which are used for simultaneous switching noise suppression have drawn great attention. It is because decoupling capacitors should be placed as near as possible to a chip to reduce parasitic inductance. Important...
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