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This paper presents the results of isothermal shear fatigue tests conducted on Sn-Ag-Cu lead-free and Pb-Sn solder alloys in fully assembled PBGA configurations. Our study, aimed to better understand the fatigue behaviors of solder alloys in the package assembly, reveals that the shear fatigue test is indeed capable of measuring the fatigue properties of the solder itself and may lead to material...
In the past two decades, many researches have been carried out to study the structural topology optimization. Most of them focused on minimizing the mean compliance of structures under material volume constraint, but stress constraints are seldom considered in the problem formulations. So, the optimum structure may be not safe because the material failure criterion is not checked during optimization...
This paper presents a suite of reliability mechanisms for P2PSIP-based conference services. These mechanisms can be divided into two categories. One is backup mechanism, which is designed to elect backup conference provider in a distributed and dynamic manner among all the participants of conference. The other category contains handover and failover mechanisms, which are designed to maintain continuous...
With the development of surface mount technology, solders are required for applications that require high reliability and dimensional stability. Composite solders reinforced with particles in a conventional solder alloy, is an attractive and potential method. This study presents series results on the binary eutectic Sn-Bi composite solders reinforced with Y2O3 particles from 0 to 3%. With this process,...
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