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Burn-in is used to force the failure of marginal devices before using into products. Usually devices are placed in a burn-in oven. The burn-in time mainly depends on the device junction temperature, so the junction temperature control is very important during burn-in test. Usually the oven ambient temperature is closed-loop controlled during burn-in, but the device junction temperature is open-loop,...
Burn-in screening test technology has been an important method to ensure integrated circuits(IC) quality and reliability. But there are many problems remains to be solved during burn-in and accurate junction temperature of IC during burn-in is one of these problems. Leakage currents are rapidly increasing with CMOS IC technology scaling, and this will lead to high junction temperature of IC in burn-in...
Industry-level plastic encapsulated devices have been used gradually in high reliability field. The screening and qualification procedures of package-level and board-level are necessary for high reliability, in which burn-in is a key part. In this paper, board-level test was carried out based on implantable brain simulator circuits of our lab. A burn-in method for surface mounted plastic encapsulated...
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