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Due to the trends of larger wafer diameters and smaller lot sizes, cluster tools need to switch from processing one lot of wafers to another frequently. This leads to more transient periods in wafer fabrication, which includes startup and close-down processes. Their efficient scheduling and control problems become more and more important. They become very difficult to solve especially when wafer residency...
Semiconductor manufacturing industry has adopted multi-cluster tools as wafer fabrication equipment that is extraordinarily pricey but highly attractive owing to their higher productivity than single cluster tools can achieve. A challenging issue is how to schedule these tools. It is especially difficult to schedule their frequently occurring close-down processes subject to wafer residency constraints...
High-mix and low-volume wafer fabrication leads to more and more lot switches in cluster tools. Practitioners must thus deal with more transient processes during such switches, including start-up and close-down. To obtain higher throughput, it is critical to shorten these processes. Much effort has been put into the steady state modeling and scheduling of cluster tools and some for start up processes...
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