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The mechanical properties of two porous ultra-low-k (ULK) dielectric thin films (porous carbon-doped silicon dioxide (pSiCOH); and octamethylcyclotetrasiloxane (OMCTS)) were measured by nanoindentation. Since a direct contact of a nanoindentation tip with a thin and brittle ULK film will likely induce damage to the film and thus alters its mechanical response, the mechanical properties measured from...
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