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The extended flicker noise measurement incorporating with BTI evaluation is applied to investigate the bulk trapping density Nt in HK/MG stacks and the correlated BTI behaviors. An effective evaluating technique on BTI/TDDB is developed. This method will help to understand the physical original of BTI degradation.
We demonstrate a novel ??remote interfacial layer (IL) scavenging?? technique yielding a record-setting equivalent oxide thickness (EOT) of 0.42 nm using a HfO2-based MOSFET high-?? gate dielectric. Intrinsic effects of IL scaling on carrier mobility are clarified using this method. We reveal that the mobility degradation observed for La-containing high-?? is not due to the La dipole but due to the...
We report for the first time that extreme EOT scaling and low n/p VTHs can be achieved simultaneously. Underlying mechanisms that enable EOT scaling and EWF tuning are explained and the fundamental device parameters including reliability of the extremely scaled devices are discussed. Record low gate leakage, appropriately low VTHs and competitive carrier mobilities in this work demonstrate the gate...
Highly scaled FinFET SRAM cells, of area down to 0.128 m2, were fabricated using high-kappa dielectric and a single metal gate to demonstrate cell size scalability and to investigate Vt variability for the 32 nm node and beyond. A single-sided ion implantation (I/I) scheme was proposed to reduce Vt variation of Fin-FETs in a SRAM cell, where resist shadowing is a great issue. In the 0.187 m2 cell,...
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