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A silicon interposer test vehicle with through silicon vias (TSVs) is evaluated under radio frequency (RF) application from DC to 10 GHz. TSVs with 30 μm diameter and 150 μm height were fabricated with one layer RDL of 20 μm line width. A group of coplanar waveguides (CPW) are designed and tested to analyze the electrical performance of the interposer under high frequency in both the time and frequency...
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