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Just in few years, three-dimensional (3D) packaging technologies have attracted much more attention. With the development of through-silicon via (TSV) technology, silicon-based device integrations have become the main stream of 3D packaging technologies. In this study, the assembly of high performance processor chip and TSV interposer is developed. From bottom to top assembly process was applied and...
2.5D/3D integration has been attracting both academic and industry interests for extending the Moore's Low in recent years and several products using such technology have been emerged. This paper introduces the development progress of key process modules for 2.5D/3D IC integration on our 300mm platform. Experiment results for high aspect ratio TSV formation, fine-pitch RDL & bumping, low cost...
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