The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Solder joints in electronic packages are frequently exposed to thermal cycling. Such exposures can occur in real life applications as well as in accelerated thermal cycling tests used for the fatigue behavior characterization. Due to the CTE mismatches of the assembly materials, cyclic temperature leads the solder joints to be subjected to cyclic (tensile/compressive) mechanical loading. On the other...
Lead free solder materials are susceptible to significant creep deformations in harsh high temperature environments including automotive, avionics, military, and oil exploration applications. In addition, dramatic degradations will occur in the creep responses of lead free solder alloys when they are exposed to long term isothermal aging during product applications at high temperatures. Such degradations...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.