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Polyimide foil, which is commonly used as a substrate in production of many electronic devices, needs to be appropriately modified due to the high smoothness and Iow adhesiveness of the surface. The wet methods of the surface modification are based on using caustic chemicals. Using a plasma method enables the successful modification of the polymer surface without producing hazardous wastes. As a result...
Modyfikowano powierzchnię folii poliimidowej w wyładowaniu elektrycznym z barierą dielektryka, które generowano prądem sinusoidalnie zmiennym o częstotliwości 50 Hz. Jako gazy robocze stosowano hel, powietrze, argon i wodór. Modyfikacji poddawano folię o grubościach 0,025 i 0,125 mm. W wyniku działania plazmy, folia ulegała trawieniu. Cienka folia trawiła się dobrze w argonie (ubytek masy 11,7 µg...
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