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This work focuses on characterizing the performance of the 3D TSVs under high speed transient simulation, which could potentially evaluate and verify the electrical models for these vertical connections. A gunning transceiver logic (GTL) I/O on-chip test IC and a CML/thermal test IC has been designed and sent for fabrication using the 3D FDSOI CMOS technology. The GTL I/O circuits are used to inject...
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