The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Recently, a serious crack issue for a commercial BGA has taken place frequently in the normal PCBA assembly line, which has lead to abnormal failure rate spikes in the first pass yield trend chart, and caused line down issue already. Both cross section and Dye & Pry has been carried out to find out the fracture mode in the suspected pin of the failed unit. The cross section result shows that both...
One interesting and challenging BGA solder ball cracked issue occurred at certain electronic production line. This paper is expected to carry out a detail investigation and improvement plan on failure mechanism, by combining some experiment methods, such as SEM/EDX, pin pull test, cross section, dye & pry etc. And also environment test thermal cycling is involved in to qualify the improved products...
In this paper, a pin pull test is introduced as an effective way to assess the PCB pad strength. The pad strength is evaluated by different level of strain, pad type, PCB life phase and accumulation effect of various stations. Finite element analysis (FEA) is employed to analyze whether the PCB material affects the pad strength. It is found that PCB pad strength is sensitive to the rework process,...
The effect of deformation on the electronic work function (EWF) has been well documented and the dislocation mechanism responsible for the change in the EWF due to deformation has been postulated. This letter reports our recent experimental investigations on the change in the EWF of tensile specimens using a scanning Kelvin probe. It was demonstrated that both strain and strain rate can decrease the...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.