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The automotive requirements have quite many challenges regarding semiconductors reliability performance, and there was no escape for small outline discrete packages. Some epoxy die attached discrete devices could not pass MSL requirements due to die attach separation, even with leadframe surface treatment and all other solutions. The brainstorming results showed soft solder die attach would be the...
The die edge-seals and circuit under fad (CUF) are structurally optimized through 3D finite element analysis (FEA). Die edge-seals having the mechanically reinforced structure units are demonstrated essential. It is also shown that FEA help extract useful structural design concepts for CUP. The Poisson effects leading to a dual-ring-shaped high stress distribution area are confirmed to be detrimental...
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