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We propose a new scheme of dynamic nets-to-TSVs assignment during floorplanning for 3D-ICs. A nontrivial area occupied by TSVs, their physical dimensions, location on the layout and the nets-to-TSVs assignment, are some of the key factors influencing the wirelength, TSV count and chip area, and consequently, impact the total delay. We address the above issues by simultaneous placement of TSV islands...
3D integration is considered as one of the most promising solutions to improve energy efficiency of heterogeneous ICs. We use floorplannning tools to evaluate power consumption related to inter-block connections for digital ICs implemented as 2D and 3D systems. We focus on 3D stacking using through-silicon-vias (TSVs). We evaluate contributions of wires, buffers and TSVs based on information available...
We have extended three existing 3D wirelength distribution models, initially developed for square modules, to handle rectangular 3D blocks. Our extended models enable the stochastic wirelength prediction from 3D chip level to 3D block level. We have performed comparative and qualitative studies of these newly developed rectangular models. Experimental results provide a comparative picture in terms...
We consider a test-scheduling problem, with layout constraints, for core-based SOCs. Individual cores have to be tested on a system level after manufacturing and therefore special test access mechanisms (TAMs) are required. The amount of additional wires needed to route TAMs depends strongly on a SOC layout. In this research, we investigate the SOC test-scheduling problem formulated as the bin-packing...
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