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We propose a new scheme of dynamic nets-to-TSVs assignment during floorplanning for 3D-ICs. A nontrivial area occupied by TSVs, their physical dimensions, location on the layout and the nets-to-TSVs assignment, are some of the key factors influencing the wirelength, TSV count and chip area, and consequently, impact the total delay. We address the above issues by simultaneous placement of TSV islands...
3D-IC technology discussed in this paper is based on vertical stacking of dies connected by through-silicon-vias (TSV). Vertical stacking helps reducing the wirelength but TSVs occupy space on device layers and their actual positions, arrangement, and physical properties determine the total wirelength. They also introduce thermo-mechanical stress that alters properties of devices that are close to...
3D integration is considered as one of the most promising solutions to improve energy efficiency of heterogeneous ICs. We use floorplannning tools to evaluate power consumption related to inter-block connections for digital ICs implemented as 2D and 3D systems. We focus on 3D stacking using through-silicon-vias (TSVs). We evaluate contributions of wires, buffers and TSVs based on information available...
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