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We present a novel 3D floorplanning algorithm with module splitting (3D-FMS). The proposed methodology allows designers to introduce and evaluate an assignment of vertically-aligned parts of the same module to different device layers. Our experimental results on MCNC and GSRC benchmarks show that 3D-FMS can generate a good floorplanning solution with reduced wirelength inside modules and optimized...
We have extended three existing 3D wirelength distribution models, initially developed for square modules, to handle rectangular 3D blocks. Our extended models enable the stochastic wirelength prediction from 3D chip level to 3D block level. We have performed comparative and qualitative studies of these newly developed rectangular models. Experimental results provide a comparative picture in terms...
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