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We present a novel 3D floorplanning algorithm with module splitting (3D-FMS). The proposed methodology allows designers to introduce and evaluate an assignment of vertically-aligned parts of the same module to different device layers. Our experimental results on MCNC and GSRC benchmarks show that 3D-FMS can generate a good floorplanning solution with reduced wirelength inside modules and optimized...
We consider a test-scheduling problem, with layout constraints, for core-based SOCs. Individual cores have to be tested on a system level after manufacturing and therefore special test access mechanisms (TAMs) are required. The amount of additional wires needed to route TAMs depends strongly on a SOC layout. In this research, we investigate the SOC test-scheduling problem formulated as the bin-packing...
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