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Package-on-package (PoP) is one of the major 3D packaging approaches. It vertically combines discrete memory and logic ball grid array (BGA) packages, where one package rests on the top of another. Recently, PoP technologies have attracted more interests, especially for portable electronics related products and applications. For the existing PoP solutions, they have the following disadvantages: (i)...
This study employed an electroless Ni-P-carbon nanotubes (Ni-P-CNTs) composite coating as a pad finish for electronic packaging. It aimed at investigating the effect of carbon on the mechanical behavior and microstructure of ball grid array (BGA) solder joints after multiple reflows. Electroless Ni-P and electroless Ni-P-CNTs composite coatings with the same P-content were prepared for comparison...
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