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This paper investigates several issues in finite element modeling of electromigration in solder joints: current density and thermal stress singularities; negative divergences of atomic fluxes due to electron current and thermal stresses; and submodeling accuracy. A copper post wafer level package is used as a test vehicle for simulation. Coupled electrical-, thermal-, and mechanical finite element...
This paper presents an approach to quantify channel performance using TWDP (transmitter waveform and dispersion penalty) with frequency-domain S-parameter data. TWDP is initially defined to characterize the performance of a transmitter in optical links. The same concept has been extended to quantify channel performance as well, especially in high-speed copper links. This paper focuses on channel characterization...
Orthogonal fluxgate sensor was built using copper wire covered by electroplated permalloy. This type of sensor core has significant advantage over the sensors based on amorphous wires: it has no magnetic material in the central part, where the excitation field is low. 11 muV/nT sensitivity and less than 1 muT perming error were achieved for the first sensor prototype. The used core geometry also allows...
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