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Radio Frequency Identification (RFID) technology has been widely used in manufacturing sites for supporting the shopfloor management. Huge amount of RFID-enabled production data has been generated. In order to discover invaluable information and knowledge from the RFID big data, it is necessary to cleanse such dataset since there is large number of noises. This paper uses n-dimensional RFID-Cuboids...
In this thesis, electrochemical corrosion and electrochemical migration characteristics of 64Sn-35Bi-1Ag (SBA) solder with In doping in 3wt.% NaCl solution are researched by potentiodynamic polarization measurement and a self-designed experiment, respectively. The surface morphology and elemental composition of corrosive products and dendrites during ECM process are determined by SEM, EDAX techniques...
Thermal shock test was performed on the SnAg3.8Cu0.7 (SAC387) solder bump interconnecting AlN and Cu substrate. Finite element modeling (FEM), cross-polarized light microscopy, scanning electronic microscopy (SEM) and EBSD were used to analyze the failure mechanism of them. It was realized that during thermal shock, the areas with higher stress would suffer from more serious IMC coarsening and then...
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