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In this paper, a pin pull test is introduced as an effective way to assess the PCB pad strength. The pad strength is evaluated by different level of strain, pad type, PCB life phase and accumulation effect of various stations. Finite element analysis (FEA) is employed to analyze whether the PCB material affects the pad strength. It is found that PCB pad strength is sensitive to the rework process,...
To accurately measure the magnetic energy difference at different positions, the Joule balance is designed to work under a high stability and sensitivity environment. This paper presents the detailed design of balance system, the vibration characteristics of the balance foundation and the deformation of balance beam. The experimental results show that the maximum displacement of foundation is detected...
Scanning thermal microscope (SThM) and electron backscatter diffraction (EBSD) techniques were used to investigate the local thermal-conductivity of a GaN-buffer-sapphire heterostructure. Compared with GaN epilayer, buffer layer displayed the low thermal-conductivity and the high strain state due to the lattice distortion.
This paper presents the results from preliminary models comparing the mechanical performance of polymer cored BGA type interconnects with conventional solid solder BGA balls. The surface evolver was first used to predict the solder fillet shapes for use in the models. The mechanical behaviour of some candidate polymer spheres were also measured and the results of these measurements used to estimate...
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