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The scattering processes and the beam shapes of electrons transmitted through an ultrathin (5-35 nm) metal film are analyzed by ballistic electron emission microscopy (BEEM) using a scanning tunneling microscope. The metal film thickness is varied for the Schottky barrier system Au/Si for which the attenuation of the ballistic beam is analyzed. The shape of the emission current-voltage characteristics...
The scattering processes and the beam shapes of electrons transmitted through an ultrathin (5-35 nm) metal film are analyzed by ballistic electron emission microscopy (BEEM) using a scanning tunneling microscope. The metal film thickness is varied for the Schottky barrier system Au/Si for which the attenuation of the ballistic beam is analyzed. The shape of the emission current-voltage characteristics...
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