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In this paper, wafer-level preapplied nonconductive films (NCFs) were used to interconnect the Cu pillar/Sn-Ag microbumps for 3-D through silicon via vertical interconnection. Thermocompression bonding is a common method to interconnect chips to substrates using NCFs, and thermocompression bonding time should be reduced to increase the bonding productivity. Therefore, isothermal bonding method without...
The Through Silicon Via (TSV) technology that uses Cu pillar/Sn-Ag double-bumps to interconnect between chips vertically is the most advanced state-of-art packaging technology. Non-conductive films (NCFs) have been introduced to enable the wafer-level processes and avoid the problems such as flux residues and voids trapping in fine-pitch interconnection. In order to increase the assembly productivity...
Rapid development of hand-held products has created new reliability concern, such as ability to withstand drop or shock condition. Different selections or combinations of solder alloy, surface pad finish, pad design have been studied to improve such reliability. However, the combination of enhancing drop reliability leads deterioration of thermal fatigue reliability. In order to find a best combination...
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