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The microstructures of the eutectic Au20Sn (wt.%) solder that developed on the Cu and Ni substrates were studied. The Sn/Au/Ni sandwich structure (2.5/3.75/2 µm) and the Sn/Au/Ni sandwich structure (1.83/2.74/5.8 µm) were deposited on Si wafers first. The overall composition of the Au and the Sn layers in these sandwich structures corresponded to the Au20Sn binary eutectic. The microstructures of...
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