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This work was designed for low-temperature mechanical properties of the solder joints, the temperature is 293K, 223K, 173K, and 123K, in order to get the mechanical strength and mechanism of fracture at low temperature; Cryogenic temperature (77K) storage experiment is applied to get microstructure of internal solder joint, and the evolution of IMC and other microstructures, as well as solder joints'...
Sn-3.5Ag nanosolder in tiny sizes can provide a practical way to solve the high soldering temperature problem of lead-free solder alloy in fine pitch interconnectivity owing to the unique nanosize effect and meantime stand a higher working temperature just as the bulk material after welding. In this paper, a simple approach to synthesis Sn-3.5Ag nanoparticles by chemical reduction at room temperature...
Sn-3.5Ag nanosolder in tiny sizes can provide a practical way to solve the high soldering temperature problem of lead-free solder alloy in fine pitch interconnectivity owing to the unique nanosize effect and meantime stand a higher working temperature just as the bulk material after welding. In this paper, a simple approach to synthesis Sn-3.5Ag nanoparticles by chemical reduction at room temperature...
This work was designed for low-temperature mechanical properties of the solder joints, the temperature is 293K, 223K, 173K, and 123K, in order to get the mechanical strength and mechanism of fracture at low temperature; Cryogenic temperature (77K) storage experiment is applied to get microstructure of internal solder joint, and the evolution of IMC and other microstructures, as well as solder joints'...
We studied the relationship between the resistive-switching properties of the Pr0.7Ca0.3MnO3 (PCMO) thin-film elements and their geometry dimensions below submicrometers. Our electrical test results of a series of PCMO-based resistive-switching devices with different sizes show that switching voltages of ±2.5 V were achieved by reducing the PCMO layer thickness to 30 nm. In addition, the reduction...
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