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In this paper the sensitivity of the decoupling matrix used for mutual coupling compensation in small size uniform circular arrays has been studied. The compensation matrix is calculated using the receiving mode technique for a 5-element uniform circular array and applied to two groups of direction finding algorithms, namely phase comparison-based (interferometry) and subspace-based algorithms. In...
In this work, we investigated the failure behavior of a commercial chip size packaging (CSP) under coupling fields of electrical current and thermal cycles. The failure process was real-time monitored through the response resistance change. Under the coupling condition, the lifetime was much shorter than that in single thermal cycle condition. Instead of the void accumulation mechanism, the excessive...
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