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The thermal resistance of a three-dimensional (3D) chip stack has been experimentally clarified by authors [1-5] and an additional cooling solution is strongly required to achieve various structures of 3D chip stacks. Especially, when a high heat dissipating chip is located as a bottom chip, cooling from the bottom side of chips (in other words, from the laminate (substrate) side) is identified to...
When a 3D chip stack is composed of some memories and a logic device such as processor, the logic device has been assumed to be located as a bottom chip in wide I/O and HBM applications. On the other hand, for high-end server applications, a processor needs to be located as a top chip because it needs to be cooled efficiently. In this case, many Through Silicon Vias (TSVs) are necessary in a memory...
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