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Panorama imaging camera, as an effective tool, has been applied widely to geological prospecting. But there exist distortions in imaging the geological object, especially prospecting excavation, owing to the shortcoming of lens. In addition, the traditional correction methods are too complex to obtain the actual applications. This paper proposes a correction method based on straight baseline, which...
Stacked chip scale packaging (SCSP) has been an increasingly important approach for realizing high density 3D packaging. During SCSP process, package will endure several thermal loadings, such as die attach (DA) cure, post-molding cure and reflow. Thermal stress may result in die crack or delamination before package is finished if thermal mismatch between internal packaging materials is too much....
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