Search results for: Ying Cheng
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 4 > 511 - 518
IEEE Microwave and Wireless Components Letters > 2014 > 24 > 3 > 140 - 142
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 4 > 511 - 518
IEEE Microwave and Wireless Components Letters > 2014 > 24 > 3 > 140 - 142