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We have developed a MEMS probe-card technology for wafer-level testing ICs with 1-D line-arrayed or 2-D area-arrayed dense pads layouts. With a novel metal MEMS fabrication technique, an area-arrayed tip matrix is realized with an ultradense tip pitch of 90 mum times196 mum for testing 2-D pad layout, and a 50-mum minimum pitch is also achieved in line-arrayed probe cards for testing line-on-center...
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