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Herein, it is reported that how a layer of samarium (Sm) with a thickness equivalent to ≈2 atoms (0.8 nm) deposited by thermal evaporation is remarkably effective at passivating polycrystalline copper (Cu) toward oxidation in ambient air. To monitor the rate of Cu oxidation in real time, slablike Cu films with a thickness of 9 nm are fabricated on glass modified with a layer of 3‐mercaptopropyl silatrane,...
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