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Aiming at producing highly uniform ultra-small solder bumps to meet the growing requirements in the area array package, a novel fabrication method based on piezoelectric diaphragm-piston droplet jetting was proposed. The principle and customized equipment of this method were introduced. Solder bumps with a diameter less than 100 mm were successfully fabricated with the customized equipment. The main...
Aiming at producing highly uniform ultra-small solder bumps to meet the growing requirements in the area array package, a novel fabrication method based on piezoelectric diaphragm-piston droplet jetting was proposed. The principle and customized equipment of this method were introduced. Solder bumps with a diameter less than 100 mm were successfully fabricated with the customized equipment. The main...
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