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Power Integrity (PI) is an important topic in today's high-speed interface designs, and the power distribution network (PDN) is a major factor in the package design. This research we propose an effective design method for a multi-layer and complex package design. The first section of this paper is to perform the current density to fast find the bottleneck of draft design for the DDR core power and...
In this paper, the package solutions for die-to-die interconnection including fine-line substrate and ASE advance wafer level package (aWLP) have been purposed. The fin-line substrate has 3um trace width and 3um trace space on top layer with copper interconnection. For aWLP, the trace width and space of interconnection on redistribution layer (RDL) is the same with fine-line substrate. The different...
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