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The moisture diffusion phenomenon and moisture stress in a specific LED module was studied in this paper. Firstly, the finite element model of the LED module was built. The moisture diffusion distribution at operation condition with 25 °C ∼ 85 °C, was analyzed. Secondly, the temperature distribution and moisture distribution of the LED module during reflow soldering process were simulated at the initial...
Stacked chip scale packaging has many good properties, such as higher packaging density, smaller signal delaying and better interconnection, which becomes one important technique of realizing 3D packaging. In this paper, the warpage and thermal stress of a three-chip stacked package which use wire-bonding connection and C4 connection during process was respectively analyzed and compared each other.
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