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The incorporation of mesopores into silica films is an effective way to reduce the dielectric constant. However, the pores reduce the film mechanical strength. This study investigates two steps for preparing coating solution. One was the reflux of the silica colloid at 70 °C. The other was the addition of TPAOH (tetrapropylammonium hydroxide) into the colloid. The reflux step can increase the mechanical...
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