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In order to extend the performances of integrated circuit (IC), new bonding approaches are being explored. Since copper has good electrical and thermal conductivity, and relatively low cost, it is widely used as the bonding material for advanced packaging. Unfortunately, the normal direct copper-to-copper bonding demands relatively high temperature, which greatly limits its applications. A low temperature...
Low temperature bonding technology has been a research hotspot in recent years due to its success of avoiding impurities interdiffusion, minimizing thermal stresses between heterogeneous materials, minimizing voids and other defects, and reducing the cost. In this work, a novel low temperature thermocompression bonding technology using nanoporous Cu (NPC) was proposed and the influences of different...
Nanoporous metals fabricated by dealloying have been utilized in a wide variety of applications including catalysis, sensors and actuators as well as low temperature bonding. In this work, nanoporous copper (NPC) for low temperature bonding was prepared by selectively dissolving Zn atoms from the Cu-Zn alloy, and the influences of electroplating time of Zn and dealloying duration on the characteristics...
Low temperature bonding technology has been a research hotspot in recent years due to its success of avoiding impurities interdiffusion, minimizing thermal stresses between heterogeneous materials, minimizing voids and other defects, and reducing the cost. In this work, a novel low temperature thermocompression bonding technology using nanoporous Cu (NPC) was proposed and the influences of different...
Nanoporous metals fabricated by dealloying have been utilized in a wide variety of applications including catalysis, sensors and actuators as well as low temperature bonding. In this work, nanoporous copper (NPC) for low temperature bonding was prepared by selectively dissolving Zn atoms from the Cu-Zn alloy, and the influences of electroplating time of Zn and dealloying duration on the characteristics...
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