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Light emitting diodes (LEDs) hold the promise for efficient, lightweight and environmental-friendly lighting sources, which is regarded as the next-generation lighting technology. Since so many problems still remain to be solved, this emerging technology has attracted the attention of a large number of researchers. Among several issues frequently discussed in the community, the long-time reliability...
Silicon-based packaging for light emitting diodes (LEDs) is the tendency of packaging for improving high-power LED performance. In this paper, a simple and high efficient wafer level packaging (WLP) based on silicon with TSV is proposed. Monte-Carlo ray-trace method is implemented to analyze the effect of the size of silicone lens on light extraction efficiency (LEE). The results show that LEE of...
The three-dimensional (3D) light-emitting diodes (LEDs) integration package based on silicon with through silicon vias (TSV) attracts a lot of attention because of a better performance, lighter package, and higher integration density. Two main kinds of LED chip including conventional chip (CC) and vertical chip (VC) encapsulated in silicon platform with and without a reflector cup are analyzed through...
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