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Recently, the application of Ag bonding wires in electronic devices has been attempted as alternative to Au bonding wires to reduce the material cost of Au. Nevertheless, Ag bonding wires have not been applied to devices due to interface corrosion problems between the Ag wire and Al pad during humidity reliability tests, such as the PCT (Pressure Cooker Test). As the technology for alloying Pd element...
To reduce material cost of Au bonding wire, Au-Ag alloy wire had been tried to use in electronic device, in alternative for Au wire. Nevertheless, Au-Ag alloy wire had not been applied to device due to failure problem during high humidity reliability test, like PCT(pressure cooker test) for a while. Recently, as the technology adding Pd element to conventional Au-Ag was developed, corrosive failure...
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