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Despite many fatigue mechanisms published for Fan-out Wafer Level Package (FOWLP), most merely focused on stand-alone package reliability or solder joint capability. Only a few explored the failures of Chip to Board Interaction (CBI) due to the difficulty for perceiving the induced CBI failures. In this paper, a unique failure mechanism was first observed by an innovative test methodology in interconnects...
The effects of dielectric slots on Cu/Low-k interconnects reliability were studied. Dielectric slots were proven to be effective in suppressing stress-induced void failure but their impact on EM reliability was found to be minimal. Physical failure analysis and finite element simulations were used to explain the possible mechanisms associated to the different effects of dielectric slots on Cu/low-k...
The correlation of time-dependent dielectric breakdown (TDDB) reliability failure with scratches generated from chemical mechanical polishing (CMP) in 45 nm backend-ofline (BEOL) process is investigated and established. The wafer map of early TDDB failure samples matches well with the defect wafer map from bright field scans. Electrical fault isolation using thermally induced voltage alteration (TIVA)...
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