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Dielectrophoretic assembly of gold (Au) nanoparticles in nanogap electrodes to fabricate continuous nanobridges is reported. Dielectrophoresis (DEP) process involves the optimization of three parameters: peak-to-peak voltage (Vpp), frequency, and time. The complete and reliable assembly of nanoparticles in the nanogap electrodes require optimization of these parameters. Frequency optimization from...
Optimized growth of segmented nanorods comprised of gold (Au) segments (Au-gap-Au) using electrochemical wet etching method is reported. The nanorods were fabricated using alumina (AAO) template of thickness 100 ??m and pore size of 200 nm. A thin silver (Ag) sacrificial layer was grown on one side of the AAO template to act as cathode. Electrochemical process was used to grow Au segments sandwiching...
Many engineering applications, particularly that of electronic packaging interconnect design, require reduced feature size and use of heat stable materials. Parallel gap welding is an attractive joining method for the formation of thermally and mechanically stable Pb-free bonds in electronic and electrical devices. This type of welding is useful in producing strong interconnections on thick-film pads...
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