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Solder is widely used in electronic packaging to connect die and substrate in die attach process. It is important to get a uniform solder distribution to provide good electrical conductivity, mechanical support as well as excellent thermal properties for packages, especially for power packages with high current densities. While nonuniform solder distribution would emerge when die moves and tilts in...
With the trend to be smaller, more integration and higher power in power electronic technology, the cooling problem has become increasingly prominent for those high power devices. Micro-channel in substrate, as an effective cooling method, has been proposed and investigated by many researchers in recent years. Warpage and stress, naturally existing in all the packaging processes due to the unavoidable...
With the trend to be smaller, more integration and higher power in power electronic technology, the cooling problem has become increasingly prominent for those high power devices. Micro-channel in substrate, as an effective cooling method, has been proposed and investigated by many researchers in recent years. Warpage and stress, naturally existing in all the packaging processes due to the unavoidable...
In this paper, the failure mechanisms of the direct bonding copper (DBC) substrate under the condition of temperature cycling are studied. The cyclic temperature considered ranges from −40°C to 200°C. Furthermore, finite element method is used to optimize the DBC substrate structure in order to reduce the thermal stress and improve the reliability and fatigue life of power modules. Various factors...
The problem of heat dissipation of high power electronics such as IGBT (Insulated Gate Bipolar Transistors) has puzzled us for long time. If the heat generated from the chips could not be eliminated away from the devices, the failure rate would rise rapidly. To deal with this problem, the micro pumps along with the microchannel embedded in the DBC substrate are proposed to remove the heat actively...
We realize artificial magneto-dielectric loading for microstrip patch antenna by etching embedded meander-line (EML) array in the ground plane under the patch. The related artificial magneto-dielectric medium belongs to the waveguided metamaterial proposed previously. Both simulation and measurement results show that the proposed patch antenna with the EML array has wider impedance bandwidth than...
The magnetic surface acoustic wave (MSAW) devices developed in recent years are a class of tunable surface acoustic wave devices (such as filters, tuners, oscillators, etc.) which are important parts of radar, sonar, TV, computers and other modern communication systems. Giant magnetostrictive thin films (RGMFs) have high energy, large magnetic response, and high elastic modulus as well as the function...
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