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We present a novel analytical approach to computing the population and geometric parameters of a multi-robot system that will provably produce specified boundary coverage statistics. We consider scenarios in which robots with no global position information, communication, or prior environmental data have arrived at uniformly random locations along a simple closed or open boundary. This type of scenario...
Sn-Ag-Cu (SAC) solders are susceptible to appreciable microstructural coarsening during storage or service. This results in evolution of joint properties over time, and thereby influences the long-term reliability of microelectronic packages. Accurate prediction of this aging behavior is therefore critical for joint reliability predictions. Here, we study the precipitate coarsening behavior in two...
Nowadays, Wireless sensor networks (WSNs) are appeared to be new and promising solutions for next generation real-time wireless monitoring applications. These WSNs could become a threat if suitable security is not considered before the deployment. However, if there is any loophole in security, that might opens the door to attackers and hence, endanger for the applications. So, user authentication...
Sn-Ag-Cu (SAC) solders are susceptible to appreciable microstructural coarsening due to the combined effect of thermal and mechanical stimuli during service and storage. This results in evolution of joint properties over time, and thereby influences the long-term reliability of microelectronic packages. Accurate prediction of this aging behavior is therefore critical for joint reliability predictions...
In this paper, total incident electron dose as an inherent parameter in secondary electron emission is experimentally demonstrated. A completely automated experimental setup allows for measuring of secondary electron yield (SEY) as a function of beam energy, angle of incidence of primary electrons, electron dose, and time. SEY data are presented for copper, plasma-sprayed boron carbide, and titanium...
Because of their very high thermal conductivity, low melting point, and high shear compliance, indium-based materials are excellent candidates for thermal interface material (TIM) applications for packaging thermally sensitive next-generation devices. However, currently used indium-based solders suffer from 2 serious shortcomings: (i) high cost due to high indium content, and (ii) very low compressive...
Sn-Ag-Cu (SAC) solders are susceptible to appreciable microstructural coarsening during storage or service, resulting in evolution of joint properties, and hence reliability, over time. Although the problem of microstructural coarsening in joints has been studied extensively, the effect of joint scale on aging kinetics has never been investigated. Understanding the scale dependence of aging is particularly...
Summary form given only. Secondary electron emission (SEE) results from bombarding materials with electrons, atoms, or ions. When studying SEE, one is usually interested in determining the secondary electron yield, defined as the number of secondary electrons produced per incident primary electron. The amount of secondary emission is well known to depend on factors such as bulk and surface properties...
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