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To elucidate the observed current capacity behavior, a model is developed that takes into account heat transport through the entire carbon nanofiber interconnect test structure and breakdown location. The model also includes variations in contact location with the support material. The resulting predicted heat dissipation and current capacity are completely consistent with experimental data.
Current-induced breakdown phenomena of carbon nanofibers (CNFs) for future on-chip interconnect applications are presented. The effect of heat dissipation via the underlying substrate is studied using different experimental configurations. Scanning electron microscopy (SEM) techniques are utilized to study the structural damage by current stress. While the measured maximum current density in the suspended...
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