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This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significant coupling noise and timing problems despite that TSV count is much smaller com- pared with the gate count. Two approaches are proposed to alleviate TSV-to-TSV coupling, namely TSV shielding and buffer insertion. Analysis results...
In this paper, we study the signal integrity issues of through-silicon-via (TSV)-based 3D IC layouts. Unlike the most existing work, our study reports the coupling noise among all nets and all TSVs used in a real processor design implemented in 3D. Our RTL-to-GDSII design flow consists of commercial tools, enhanced with various add-ons to handle TSV and 3D stacking. Using this tool flow, we generate...
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