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This work is the first to achieve a low temperature (≦250 °C) and low pressure (≦0.1 MPa) fluxless bonding of plateless Cu-Cu substrates by transient liquid phase sintering (TLPS) of Ag nanoparticles and Sn-Bi eutectic powder. Sintering was conducted under formic environment to assist the wetting of Sn-Bi and to suppress the oxidation of Cu substrate. Effect of mixture composition to the shear strength,...
A low temperature and low pressure fluxless bonding of plateless Cu-Cu substrates has been achieved by transient liquid phase sintering of Ag and Sn-Bi eutectic powder mixture in a formic acid reducing environment. The effects of Sn-Bi addition amount and sintering temperature to the shear strength and microstructure were investigated. Remelting temperature of the sintered paste was also examined...
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