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Celem pracy było porównanie komercyjnie dostępnych oraz opracowanych nowych folii szklano-ceramicznych pod kątem predyspozycji do zastosowań w elektronice mikrofalowej. Wytworzone technologią LTCC porowate oraz lite kompozyty LTCC bazujące na ceramice Al2O3 lub kordierycie zostały poddane analizie SEM z EDS, która ujawniła ich niejednolitą strukturę wewnętrzną. Przeprowadzono pomiary przenikalności...
This article focuses on the influence of thermal shocks and Cu addition on tin whiskers growth on the surface of tin-rich materials and alloys. The tests were carried out on real samples manufactured with classical PCB technology. Four Pb-free materials i.e. pure Sn, Sn99Cu1, Sn98Cu2 and Sn97Cu3 were tested from the point of view of susceptibility to whisker formation after thermal shocks. Results...
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