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Solder joint crack is increasing with increasing of warpage caused by larger Wafer Level Chip Size Package (WLCSP). Bump Support Film (BSF) were proposed as a protect material for preventing a solder joint crack of bumps. The BSF was constructed of a back grind tape and Bump Support Layer (BSL) which was composed of thermosetting epoxy resin. One of the key points of forming the BSL on a wafer which...
We investigate theoretically and experimentally the factors to influence on the core height when the Mosquito method is applied. Using the simulation analysis, we find a correction method to align the core height accurately.
On the transmission line, connectors cause signal integrity, or SI reduction because their parasitic inductances bring on characteristic impedance mismatching. Particularly, the connectors used in high-speed bus systems, such as PCI-express, USB, and SATA in GHz domain cause serious SI degradation, resulting in mal-operation in the systems. The transmission systems on printed circuit boards (PCBs)...
This paper proposes an equivalent model of the coupling capacitance between TSVs and adjacent RDL. Based on the scalar potential integral equation and cylindrical accumulation mode basis functions, an efficient method of extracting the coupling capacitance is present. The scalability of the proposed model is verified by simulation and our results show that an accuracy of 10% is achieved from the analytic...
A dual-band millimeter-wave (mmW) dielectric resonator antenna (DRA) in silicon based integrated passive device (IPD) technology for unlicensed V-band (57–64 GHz) and E-band (71–86 GHz) applications is proposed in this paper. In the proposed structure, dielectric resonator (DR) was fed by using vertical coupling feed architecture to improve the antenna efficiency and gains. The simulated results show...
Cu to Cu bonding technology of IC package has the potential to replace solder joint in Future trends. The Cu to Cu bonding technology compared with other joint methods for IC package, it can solve the reliability problems such as electromigration, brittle intermetallic compound or other issues. At present, Cu to Cu bonding methods have been wide developed, but the microcosmic mechanisms of Cu to Cu...
A 25.78-Gbit/s × 4-ch active optical cable (AOC) with a ultra-compact form factor is proposed. The size of the proposed AOC is 5.2 cm3, which is 45-% smaller than the standard form factor of a pQSFP. By utilizing a gapped ground electrode structure, the proposed AOC demonstrated 25.78-Gbit/s error-free optical transmission under all-channels (4-ch) operation, and improved bit error rate (BER) power...
We present a new bidirectional optical subassembly (BOSA) packaging method which utilizes silicon optics and mechanics to integrate a lens, a DFB laser, a monitor photodiode (MPD) and a wavelength division multiplexing (WDM) filter into a silicon submount. The technology enables a compact packaging form within in a single trasnsistor outline can (TO-can) for BOSA. We made most of the assembly process...
An overview on the recent progress of Si insulated gate bipolar transistors (IGBTs) and SiC MOSFETs as key components in today's power electronic system is given. The state-of-the-art device concepts are explained as well as an outlook about ongoing and foreseeable development steps are shown.
We developed 3.3kV All-SiC power module on which SiC-MOSFET and SiC-SBD were mounted for electric power distribution apparatus. This power module has characteristic structure of pin-connections and resin-molded. Total switching loss of the module is lower than the module which mounted Si-IGBT and Si-FWD more than 60 percent.
GaN-HEMT achieves the reduction in size and weight of power conversion circuits, thanks to its high frequency switching characteristics. However, the switching speed and low threshold voltage may cause a false turn-on phenomenon, which is a fatal effect for the applications. It is urgent issue to tackle and avoid this problem by modifying the circuit conditions. In this letter, the theoretical analysis...
In this study we investigated the effect of chemical etching process of a steel plate (SPCC) by phosphoric acid (H3PO4 aq. (10wt%) at 30–60°C for 300–1200s) on the surface morphology in order to enhance the welding strength of a carbon fiber reinforced thermoplastic (CFRTP) plate and the preprocessed SPCC plate joined by ultrasonic welding. As a steel plate was pre-processed, the open pores were obtained...
A 3D packaging based 4-channel X-band receiver module is implemented using low temperature co-fired ceramic (LTCC) technology. A dual-mode X-band bandpass filter (BPF), an lumped-element branch-line coupler and an lumped BPF is proposed for the receiver module, respectively. The overall size of the module is only 54 mm × 60 mm × 1 mm. The measured gain parameter, noise figure (NF), image rejection...
Fan-Out Wafer Level Packages (FOWLPs) and Fan-Out Panel Level Packages (FOPLPs) have been proposed for promising candidates of the advanced packages for multifunctional LSI with many I/O (input/output). FOPLP is expected to reduce the cost of FOWLP by improving the productivity per substrate. Dielectric materials for redistribution layers (RDLs) are one of the most important materials for FOPLPs....
We present a low loss connector optimized for multimode polymer waveguides. The results show a demonstrator using polymer waveguides with a square cross section which were coupled to glass MM fiber with average loses of 0.5 dB per connector and over 100 matching cycles without degradation.
The ultrasonic wire bonding has been applied in the semiconductor packaging industry ever since its innovation in the 1960s. The mechanisms of the bonding process, however, are still unclear. According to state-of-the-art, the extremely short bonding process can be divided into four phases. These phases at the bonding interface were analyzed either from a side view or from a 2-D view but only after...
In this work, low temperature of 200 °C, low pressure of 0.1MPa, fluxless and plateless Cu-Cu bonding in SiC power module is achieved by the transient phase liquid sintering (TLPS) of Cu nano particle and Sn-Bi eutectic powder. In this paper, shear strength at room temperature and 150 °C of two compositions of Cu mixed with Sn-Bi is investigated and the factor influencing the shear strength at 150...
In this paper, we focus on the coupling loss of polymer waveguide based optical links, which exhibits a serious impact on the power budget in such a short-reach link. In particular, the optimum core size of polymer waveguides for the low coupling loss with VCSELs and PDs with small effective area is investigated both theoretically and experimentally.
This paper designs a System-in-Package (SiP) device with DSP + FPGA + ADC as the basic architecture. The diffusion thermal resistance model of SiP devices is established, which reduces the thermal resistance of the device by using special encapsulation materials and high heat transfer efficiency. At the same time, the temperature grade of SiP devices is improved. The laboratory temperature test shows...
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