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The paper describes an effective procedure to extract the reduced order models of multi-wire on-chip interconnects. These models take into consideration effects of the high frequency electromagnetic field, such as propagation, skin effect, substrate losses, etc. The frequency dependent p.u.l. line parameters are extracted by solving with finite integral technique (FIT) two field problems with appropriate...
A new, accurate and efficient coupled interconnect simulation algorithm is presented in this paper. This algorithm eliminates redundancies present in simulation of interconnect networks by exploiting the repetitive nature of segments in traditional interconnect discretization methods with the aid of domain decomposition methods. Since the proposed algorithm does not perform any approximations, the...
In this paper, we propose a simple and efficient model to predict the timing impact of crosstalk in high-speed interconnects with impedance discontinuities. This model is based on the reflection and superposition principles. The results of the simple model are accurate to picoseconds or less, when compared to HSPICE simulations with 1~40mm interconnect length. The model can also be extended to deal...
The rigorous method of calculations of characteristics of two-wire lines (twisted pairs) inside the metal armor and of a mutual coupling between lines is considered. It is shown that the mutual coupling between lines in multiple-conductor cables results in appearance of electromagnetic interferences (crosstalks) in communication channels. The voltages values (interferences) across the impedances placed...
The accurate computation of partial elements plays a key role in ensuring the accuracy and the stability of the Partial Element Equivalent Circuit (PEEC) method. Inaccuracies in partial elements computation, even at very high frequencies, may generate late time instabilities. On the other side, accurate computation of partial elements becomes prohibitively cumbersome when performed at high frequencies...
The point-to-point partial self inductance of an infinite and perfectly conducting ground plane has been analytically calculated in closed form. The point-to-point mutual coupling between ground plane and a trace parallel to the ground plane has been expressed in terms of an integral, which should be solved numerically. The calculations are based on a new scalar potential directly related to the concept...
Silicon technology on-chip single and coupled coplanar transmission lines have been measured on wafer up to 50 GHz. De-embedding was performed using various methods including the L-2L technique [1,2] by measuring two transmission lines of original and double length. A novel approach has been used for the measurement of the coupled structures using conventional two port VNA. Results are investigated...
The paper describes novel methodology for high frequency link/bus validation. For the first time the entire interconnect length range is covered. Frequency shmoo emulates PCB length change. The discovered resonance behavior correlates perfectly with theoretical prediction.
We investigate the effect of uncertainties in the cross- sectional parameters of ungrounded coplanar waveguides (CPWs) on the characteristic impedance and the propagation constant. For our calculations, a quasi-TEM model is used that takes into consideration the effects of non-ideal conductors, substrate loss and finite metallization thickness. The propagation of uncertainties is studied with the...
Realizing electrical printed circuit boards with integrated optical interconnects for high bandwidth interconnects requires numerical models and procedures for analyzing and optimizing signal propagation within optical multimode waveguides. This paper presents a method based on the finite element method with edge elements in order to calculate the propagation constants of the guided modes of graded-index...
The PoP (Package on Package) design procedure is described in this paper, focusing principally on the constraints and the system characteristics. The PoP structure is more and more diffused because it increases the customer flexibility and the final yield by means of a separate testing of Top and Bottom devices. In this paper, a Top PoP design, composed by two stacked memory dice (a NOR Flash and...
This paper presents an outline of a new integration method and describes the results of its application in simulating electric circuits in the time-domain. The proposed method does not suffer from the stability vs. order limitation of classical linear multistep methods. Hence, it enables using arbitrarily high- order approximations to the circuit waveforms while maintaining the stability over the...
We present in this paper, based on HFSS simulation studies, a simple way to improve a PCB to DIE transition (trough a Plastic Ball Grid Array (PBGA) package) for a 50 Ohm impedance of reference. The method uses well known technique for the synthesis of Low Pass (LP) filter based on Standard Engineering normalized tables. A II model of the PBGA transition at high frequency is used as one of the embedded...
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