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A thermal position sensor was fabricated and evaluated. The device consists of an array of temperature sensing elements, fabricated entirely on a plastic substrate. A novel fabrication technology was implemented which allows direct integration with read out electronics and communication to the macro-world without the use of wire bonding. The fabricated sensing elements are temperature sensitive Pt...
An acoustic field is used to increase the critical heat flux (CHF) of a flat-boiling-heat-transfer surface. The increase is a result of the acoustic effects on the vapor bubbles. Experiments are performed to explore the effects of an acoustic field on vapor bubbles in the vicinity of a rigid-heated wall. Work includes the construction of a novel heater used to produce a single vapor bubble of a prescribed...
An innovative and accurate dynamic compact thermal model extraction method is proposed for multi-chip power electronics systems. It accounts for thermal coupling between multiple heat sources. Transient electro-thermal coupling can easily be taken into account by system designers. The method is based on a definition of the optimal thermal coupling point, which is proven to be valid even for transient...
An overview on recent developments in thermal interfaces is given with a focus on a novel thermal interface technology that allows the formation of 2-3 times thinner bondlines with strongly improved thermal properties at lower assembly pressures. This is achieved using nested hierarchical surface channels to control the particle stacking with highly particle-filled materials. Reliability testing with...
Thermal FEM (Finite Element Method) simulations can be used to predict the thermal behavior of power semiconductors in application. Most power semiconductors are made of silicon. Silicon thermal material properties are significantly temperature dependent. In this paper, validity of a common non-linear silicon material model is verified by transient non-linear thermal FEM simulations of Smart Power...
The use of multi-layer ceramic chip capacitors as integrated passive in e. g. system in package applications needs methods to examine and predict their reliability. Therefore, a nondestructive failure analytical technique is described to detect cracks in the ceramic and the metallic layers within encapsulated 0402 SMD capacitors. After choosing from techniques to reproducibly generate cracks, it is...
Micro Porosity Sintered wick is made from metal injection molding processes, which provides a wick density with micro scale. It can keep more than 53% working fluid inside the wick structure, and presents good pumping ability on working fluid transmission by fine infiltrated effect. Capillary pumping ability is the important factor in heat pipe design, and those general applications on wick structure...
Electronic devices have been minimized but the performance of those is becoming better and better. Therefore it is needed to develop new cooling methods suitable for a thin packaging structure with high thermal density. The thin flat plate type micro CPL(capillary pumped loop) with the thickness less than 2 mm was developed in this study. The proposed micro CPL has two staged grooves in evaporator...
In this paper we present the thermal and mechanical analysis of high-power light-emitting diodes (LEDs) with ceramic packages. Transient thermal measurements and thermo-mechanical simulation were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistance from the junction to the ambient was decreased from 76.1degC/W to 45.3degC/W by replacing plastic mould...
This paper will deal with the modeling-problem of combining thermal subsystems (e.g. a semiconductor module or package with a cooling radiator) making use of reduced models. The subsystem models consist of a set of Foster-type thermal equivalent circuits, which are only behavioral models. A fast algorithm is presented for transforming the Foster-type circuits in Cauer-circuits which have physical...
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